Meet the recipients of the 2026 IEEE Medals—the group’s highest-level honors. Introduced on behalf of the IEEE Board of Directors, these medals acknowledge innovators whose work has formed fashionable expertise throughout disciplines together with AI, training, and semiconductors.
The medals can be offered on the IEEE Honors Ceremony in April in New York City. View the complete checklist of 2026 recipients on the IEEE Awards website, and comply with IEEE Awards on LinkedIn for information and updates.
Sponsor: IEEE
Santa Clara, Calif.
“For management within the growth of graphics processing items and their software to scientific computing and synthetic intelligence.”
Sponsor: IBM
Pittsburgh
“For contributions to the development of societal enchancment and training via modern expertise.”
Sponsor: Nokia Bell Labs
University of California, Berkeley
International Computer Science Institute
“For contributions to Internet structure, community useful resource allocation, and software-defined networking.”
Sponsor: Mani L. Bhaumik
Co-recipients:
Erik Dahlman
Stefan Parkvall
Johan Sköld
Stockholm
“For contributions to and management within the analysis, growth, and standardization of mobile wi-fi communications.”
Sponsor: Google
Medford, Mass.
“For contributions to computer vision and simulation algorithms, and for management in growing packages to advertise STEM careers.”
Sponsor: IEEE Edison Medal Fund
“For pioneering contributions to biomedical imaging, terrestrial optical communications and networking, and inter-satellite optical hyperlinks.”
Sponsor: Toyota Motor Corp.
University of Texas at Arlington
“For contributions to advancing electrical security within the office, integrating renewable energy and grid modernization for climate change mitigation.”
Sponsor: IEEE Foundation
Reston, Va.
“For management in communication networks, together with acceleration of digital fairness, accountable Artificial Intelligence, and the promotion of variety and inclusion.”
Sponsor: Qualcomm, Inc.
“For contributions to coding for dependable communications and networking.”
Sponsor: Buddies of Nick Holonyak, Jr.
University of California, Santa Barbara
“For seminal contributions to compound semiconductor optoelectronics, together with high-efficiency seen light-emitting diodes, lasers, and LED shows.”
Sponsor: IEEE Engineering Medicine and Biology Society
“For pioneering contributions to wearable affective computing for well being and wellbeing.”
Sponsor: Apple
“For contributions to sign modeling, coding, and recognition for speech communication.”
Sponsor: ARM, Ltd.
“For the event of the recollision mannequin for sturdy area gentle–matter interactions resulting in the sphere of attosecond science.”
Sponsor: IEEE Life Members Fund and MathWorks
James H. McClellan
“For basic contributions to electrical and computer engineering training via modern digital signal processing curriculum growth.”
Sponsor: IEEE Jun-ichi Nishizawa Medal Fund
Hanover, N.H.
“For the invention, growth, and commercialization of the CMOS picture sensor.”
Sponsor: Intel Corp.
Santa Clara, Calif.
“For pioneering parallel computing architectures and management in semiconductor design that remodeled synthetic intelligence, scientific analysis, and accelerated computing.”
Sponsor: RTX
“For contributions to polarimetric synthetic aperture radar imaging and its utilization.”
Sponsors: IEEE Industry Applications, Industrial Electronics, Power Electronics, and Power & Energy societies
“For contributions to Z-Supply and modular multi-level converters for distribution and transmission networks.”
Sponsor: Northrop Grumman Corp.
LogiQ, Inc.
Arlington, Va.
“For management in national security, civil, and industrial systems engineering and growth of chic design ideas.”
Sponsor: IBM
San Jose, Calif.
“For contributions to database question languages, significantly Structured Question Language, which powers many of the world’s knowledge administration and evaluation techniques.”
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